Process Engineer (WB)

OUR STORY

At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society. As a global semiconductor company, our advanced technologies and chips form the hidden foundation of the world we live in today.

When you join ST, you will be part of a global business with more than 122 nationalities, present in 40 countries, and comprising over 49,000 diverse and dedicated creators and makers of technology around the world.

Developing technologies takes more than talent: it takes amazing people who understand collaboration and respect. People with passion and the desire to disrupt the status quo, drive innovation, and unlock their own potential.

Embark on a journey with us, where you can innovate for a future that we want to make smarter and greener, in a responsible and sustainable way. Our technology starts with you.

YOUR ROLE

Responsible for developing, optimizing, sustaining, and continuously improving Die Attach and Wire Bond processes to achieve high product quality, process stability, production efficiency, and cost effectiveness while meeting customer requirements and manufacturing targets.

The role focuses on ensuring robust die bonding and wire bonding processes, minimizing process defects, improving yield, enhancing equipment and process performance, and driving continuous improvement through engineering methodologies such as 8D, DMAIC, SPC, DOE, FMEA, and other problem-solving tools.

A. Process Engineering & Sustaining

• Develop, optimize, and sustain Die Attach and Wire Bond processes to ensure stable and capable manufacturing operations.
• Establish and maintain process parameters, specifications, operating windows, and process control standards.
• Monitor daily production performance, process stability, yield, and defect trends.
• Provide engineering support for new product introduction (NPI), process qualification, and technology transfer.
• Ensure process compliance with customer requirements, internal standards, and quality management systems.
• Drive process standardization and best practices across production lines.

B. Yield Improvement & Defect Reduction

• Drive continuous yield improvement and defect reduction initiatives.
• Identify major process contributors to yield loss through Pareto analysis and root cause investigations.
• Lead structured problem-solving using 8D, 5 Why, Fishbone, and DMAIC methodologies.
• Establish corrective and preventive actions (CAPA) to eliminate recurring defects.
• Monitor and improve key Die Attach and wire bond defects.

C. Process Optimization & Equipment Improvement

• Optimize Die Attach and wire bond machine parameters.
• Work with Equipment Engineering to improve machine capability, reliability, and process repeatability.
• Conduct DOE and process capability studies (Cp, Cpk).
• Evaluate new materials, equipment, tooling, and process technologies.
• Support new equipment installation, qualification, and production release.
• Support new product introduction and process readiness before mass production.
• Review and approve engineering documentation, including process flow, PFMEA, control plan, and work instructions.

D. Quality & Customer Support

• Lead technical investigations for customer complaints related to Die Attach and wire bond.
• Provide technical analysis and corrective action reports.
• Support internal audits, customer audits, and quality system requirements.
• Ensure compliance with applicable quality standards and customer-specific requirements.
• Drive risk assessment and preventive controls to avoid process escapes.

E. Cost Reduction & Productivity

• Drive material cost reduction and process optimization.
• Reduce material consumption, machine downtime, and production scrap.
• Improve machine utilization and process cycle time.
• Lead productivity improvement projects.
• Quantify financial benefits and cost savings from engineering improvements.

YOUR SKILLS & EXPERIENCES

• PhD, Master’s, or Bachelor’s degree in Engineering or a related field, preferably Mechanical, Electrical, Electronics, Material Science, or Material Engineering.
• Minimum 3 years of experience in semiconductor manufacturing or process control.
• Knowledge of DOE, FMEA, SPC, DMAIC, and 8D.
• Strong analytical and troubleshooting skills.
• Good communication and teamwork skills.
• Proficient in MS Excel, PowerPoint, and other Office tools.
• Proactive, organized, and solution oriented.
• Able to work independently and in a fast-paced environment.

ST is proud to be one of the 17 companies certified as a 2026 Global Top Employer and the first and only semiconductor company to achieve this distinction. ST was recognized in this ranking thanks to its continuous improvement approach and stands out particularly in the areas of ethics & integrity, purpose & values, organization & change, business strategy, and performance.

At ST, we endeavor to foster a diverse and inclusive workplace, and we do not tolerate discrimination. We aim to recruit and retain a diverse workforce that reflects the societies around us. We strive for equity in career development, career opportunities, and equal remuneration. We encourage candidates who may not meet every single requirement to apply, as we appreciate diverse perspectives and provide opportunities for growth and learning. Diversity, equity, and inclusion (DEI) is woven into our company culture.

To discover more, visit st.com/careers.